Master Bond EP36AOFormulated for electrical potting and encapsulation applications, Master Bond EP36AO combines high thermal conductivity with thermal stability. According to the company, the epoxy is characterized by:

  • This flexible, heat resistant epoxy has superior mechanical properties.
  • Serviceable over the wide temperature range of -80 to +500°F, it provides high performance in harsh conditions.
  • Once cured, it features solid electrical characteristics including a dielectric strength of 400 volts/mil, a volume resistivity of 2-3 x 1012 ohm-cm and thermal conductivity of 9-10 BTU•in/ft2•hr•°F at 25°C.
  • This system has a coefficient of thermal expansion exceeding 75 in/in x 10-6/°C at 60°C and a tensile strength of over 2,000 psi.
  • It is a capable adhesive and coating that adheres well to both metallic and non-metallic substrates and it features long-term chemical resistance to an array of organic and inorganic chemicals.
  • As a one-component system, it doesn't require any mixing and offers the convenience of flexible cure schedules.
  • A typical gel time is 30 minutes at 180°F, with full cures attained in 2 to 2½ hours at 300°F; this can be shortened further at higher temperatures.
  • EP36AO will retain its liquidity as long as the temperature does not exceed 180°F.
  • It is supplied as a solid and has a minimum shelf life of three months but can last as long as six months in its original unopened container.
  • It is available in pints, quarts, gallons and 5-gallon containers; it is now also available in conveniently prepared 30 gram cookies.