Master Bond EP37-3FLFMaster Bond has developed the EP37-3FLF polymer system for demanding applications in which highly flexible, impact-resistant bonds are required. This optically clear, 2-component epoxy is also highlighted by:

  • Optimal resistance to cryogenic temperatures and severe thermal cycling.
  • Low exotherm, making it ideal for a potting, encapsulating and casting system, especially where wider cross section thicknesses are specified.
  • The power to cure without stressing delicate electronic components.
  • Operational temperatures from 4 K to 250°F.
  • The ability to cure at room temperature in 2 to 3 days or faster at elevated temperatures.
  • A convenient 1-to-1 mix ratio by weight or volume.
  • A low mixed viscosity of 1,400 to 1,500 CPS.
  • A bond shear strength that exceeds 2,000 PSI and a T-peel strength of 25 PLI.
  • An elongation of 180 percent and excellent electrical insulation properties.
  • The flexibility to bond well to a variety of substrates, including metals, glass, ceramics, rubbers and many plastics.