Advanced Thermal Solutions' maxiFLOW™ heat sinksAdvanced Thermal Solutions, Inc. has introduced a line of lower height maxiFLOW™ heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature:

  • A spread fin array that maximizes surface area for more effective convection (air) cooling.
  • Standard sink heights as low as 9.5 mm.
  • Extruded aluminum construction, which minimizes thermal resistance from the base to the fins and minimizes weight.
  • A device junction temperatures (Tj) reduction of more than 40 percent below the temperatures achieved using other heat sinks.
  • Pre-assembly with ATS maxiGRIP™ mounting hardware, which includes a plastic frame clip that snaps securely around the component.
  • Compliance with Telcordia GR-63-Core, ETSI 300 019 and MIL-STD-810 shock and vibration testing standards.
  • A thermally conductive, phase-change interface pad to maximize the heat transfer from component to the cooling solution.