Laser Ablation Stepper
Fri, 07/12/2013 - 9:46am
SUSS MicroTec introduces its latest generation laser ablation stepper. This ELP300 Excimer laser platform is designed for high volume manufacturing and processing of wafer sizes between 200 and 300mm.
- Employing Excimer laser technology to directly create microstructures in lieu of traditional photolithography and wet etch approaches
- Address the challenges in manufacturing next generation semiconductor packages
- Address a means to lower manufacturing costs
- Environment friendly
- Eliminates the need for wet etching process steps utilizing toxic materials