Product Releases

Thermally Conductive, Low Viscosity Epoxy

Tue, 08/31/2010 - 1:26pm

Master Bond’s EP30FLAO two component epoxy resin systemMaster Bond’s EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low viscosity epoxy:

  • Has excellent flow characteristics, making it ideal as a thermally conductive potting compound.
  • Features a wide service temperature range of 4K to 250ºF.
  • Has a thermal conductivity of 9–10 BTU/in/ft²/hr/ºF.
  • A viscosity of 5,000 to 6,000 cps at 75ºF.
  • Has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.


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