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SUSS MicroTec introduces its latest generation laser ablation stepper. This ELP300 Excimer laser platform is designed for high volume manufacturing and processing of wafer sizes between 200 and 300mm.

  • Employing Excimer laser technology to directly create microstructures in lieu of traditional photolithography and wet etch approaches
  • Address the challenges in manufacturing next generation semiconductor packages
  • Address a means to lower manufacturing costs
  • Environment friendly
  • Eliminates the need for wet etching process steps utilizing toxic materials

www.suss.com

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