FCI will unveil three new connector solutions at this year’s DesignCon 2014. The first new product is an I/O cabling solution that supports signal transmission speeds of up to 40 Gb/s. Designed to minimize impedance mis-match and signal loss, this new connector is ideal for high speed 25G+ packaging applications where signal performance integrity is critical. The second product to be unveiled was developed to address applications that require higher current density and less power loss in a low-profile form factor. This connector is able to offer a 30 percent reduction in contact resistance, which increases its current carrying capacity. It also features molded-in guide pins to facilitate modular system assembly. The last new product that will be debuting is specifically designed for applications requiring a direct pluggable connection to an uninsulated bus bar. This new product will complement FCI’s bus bar power distribution products by providing a solution with improved electrical performance and long-term reliability.
DesignCon 2014; Santa Clara, CA Jan. 28-31 Booth # 403