Balluff’s new generation of Distributed Modular I/O can be used in a cost-effective way to replace standard slice I/O and distributed I/O solutions. According to the company, the solution is characterized by:
- Offering IP67 protection and industry standard connectors, many types of control data can be collected.
- Utilizing the vendor neutral standard IO-Link, the master block can communicate with up to four slave devices and then send their combined data back to the controller over the CC-Link network.
- In lieu of a backplane, each slave device is connected to the CC-Link IO-Link master by an industry-standard M12 port, creating an IP67 connection.
- With the ability to be installed within a 20 meter radius from the master device, slave devices can be easily distributed across the machine without the use of cumbersome and costly controls cabinets that are typically used in today’s CC-Link network architectures.
- The CC-Link IO-Link masters support daisy-chain connections as well as trunk and drop network architectures for easier troubleshooting.
- The master has an intuitive push-button display that allows the user to view and set the station address and then the display can be locked from the controller to avoid tampering.